Shinkawa has built a wealth of knowledge and expertise across a wide range of sophisticated hardware and software technologies, always in cutting-edge fields, including robotics, image processing systems and precision control, as exemplified by the world’s first automatic wire bonders. We are the total manufacturer in the world who offers all the equipment required for bonding, including die bonders and flip chip bonders as well as wire bonders. And we consistently deliver customer satisfaction by comprehensively identify bonding equipment needs and applying this knowledge to marketing and research and development.